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- MEMS Foundry
- We possess MEMS foundry equipment ranging from photo lithography aligner to packaging equipment. This gives us the capability to obtain high level quality control. Especially we own DRIE equipment for Si dry etch processing, which is used in the development of high-end MEMS gyroscope, accelerometer, and pressure sensors. We specialize particularly on deposition and drying etching of Oxide mask (TEOS; SiO2) that is used in high aspect ratio silicon etch manufacturing. We provide high quality foundry services based on over ten years of experience with self-developed manufacturing techniques.
Processes
| Wafer process | Dry etching | DRIE, SiO2,AL, Ashing |
| Deposition | TEOS SiO2,Thermal evaporation | |
| Thermal oxidation, PECVD SiO2 | ||
| Photolithography | x1 Aligner | |
| Bonding | Anodic | |
| Packaging | Interconnection | Wire ball bonding |
| Vacuum packaging | Wafer level anodic bonding | |
| Inspection | Geometry | Microscope |
| Profile | SEM, Laser profiler, Alpha-step, Nanospec | |
Facilities
| Equipment | Manufacturer | Specifications |
| DRIE | ADIXEN | Aspect ratio: over 30 |
| P-5000 | Applied materials | TEOS SiO2 deposition, SiO2 etching |
| Evaporator | Korea vacuum tech | Au, Al, Ti Cr |
| Bonder | SUSS microtec | Vacuum, Anodic, Eutectic, Adhesive |
| Aligner | SUSS microtec | 6" |
| Asher | TEPLA | Microwave type, Batch and specimen |
| Flip-chip bonder | TRESKY | 2mm x 2.5mm ~ 10mm x 12mm |
| Wire bonder | Kulicke & soffa | Manual ball bonder |
| Dicing saw | Disco | Si, Glass, Quartz, Sapphire, SiC etc |
| Alpha-step | KLA-tencor | Stylus type |
| Nanospec | Nanometrics | Range: 25~750,000Å |
| SEM | TESCAN | Resolution: 3.5nm x 4 ~ x 100000 |
| Laser profiler | Keyence | Non-contact type |
| Microscope | Nikon | x5, x10, x20, x50 |
