SMT 제조설비

우주•항공 및 각종 무기체계의 운영환경에 적합한 PBA 조립/검사 설비 및 인력을 보유하고 있습니다.

1 ...

Screen Printer

2 ...

Solder Inspection

3 ...

Chip Mounter

4 ...

Reflow

 

설비특징

Process Facility Specification
Screen Printer US-2000X
  • Printing Accuracy ; +/- 0.0125mm
  • Repeatability : +/- 0.008mm
  • PCB Size : 550mm * 440mm
Fast Chip Mounter DECAN F2
  • Mounting Capability : 0.045sec/Chip (80,000CPH)
  • 10 Spindle * 2 Gentry
  • Applicable PCB : Max 510㎜ X 460㎜ (Dual Lane)
  • Applicable Components : 0402 ~ 16㎜
Multi
Mounter 		DECAN L2
  • Mounting Capability : 0.065sec/Chip (56,000CPH)
  • 6 Spindle * 2 Gentry
  • Applicable PCB : Max 510㎜ X 460㎜ (Dual Lane)
  • Applicable Components : 0402 ~ 55㎜
A.O.I XCEED
  • Applicable PCB : Max 410㎜ X 350㎜
  • 3D Data Scan Speed : 35㎤/SEC
  • Inspection resolution (Sub-pixel technology) : 5㎛
Reflow Heller 1809MKIII
  • Heat 10 Zone, Cooling 2 Zone
  • Air/Nitrogen is heated and circulated.
  • Heating Temp. : 400℃
  • PCB Size : 60mm ~ 560mm

SMT 관련 인증

Category Title
System AS9100
Engineer /
Operator/Q.C 		IPC-610 (CIT, CIS)
Standard MI-I-0840(Rev. 00)
(SMT Work Standard)
Clean Room Cubic Feet 10,000